The solid-state microwave remote plasma source(RPS) system introduces the leading German plasma technology, which mainly designed with AC-DC power supply, 3kW solid-state microwave generator, remote plasma chamber, microwave transmission waveguide and isolator.
The RPS generates excited gases in the plasma chamber, which leave the RPS as uncharged radicals. The uncharged radicals are introduced into the process reactor and etch the semiconductor wafers there without damaging the integrated circuit
Provide high concentration, low temperature and more uniform active radicals, effectively control the reaction uniformity and reduce contamination. It is a better solution for dry treatment of semiconductor materials.
> Using the latest technology of solid-state microwave generator guarantees high frequency and power stability
> Long service life
> Quartz plasma tube or ceramic, sapphire.Which can be applied to various gases
> Flexible, friendly exchange of the plasma tube
> Patented design of microwave plasma applicator, with high load matching and the reflected power is less than 1%
> Plasma ignition within the full pressure range without auxiliary equipment
> High ionization rate and speed
Item | Feature |
Frequency | 2450MHz±50ppm |
Microwave power output | 100-3000w |
Output accuracy | ≤ ±0.5% @600w-3000w |
Gases | O2,N2, H2, Ar, He, CF4, SF6, Cl2 ,etc. |
Operating pressure range | 0.06-20 Torr |
Gas flow | 0.1-10 SLM |
Plasma Tube Material | quartz, ceramic or sapphire |
Input AC power | AC 208V, 47-60Hz, 35A, 3 phase 4 wire |
Cooling | Circulating water cooling MW generator: 8L/MIN,18-25℃,1/4" quick interface |
Control interface | DB9F / RJ45 |
Plasma radicals outlet | ISO-K 63 |
Dimensions | 350*250*140mm (RPS) 500*482.6*132.5mm(AC-DC power supply) |
Weight | 35kg(MW generator & RPS),24kg(power supply) |
Photoresist removal in front-end-of-line and back-end-of-line semiconductor production
Etching in front-end-of-line and back-end-of-line semiconductor production
Etching of polyimide / Capton foils for fexible PCB roll-to-roll applications
Surface cleaning before soldering and sticking processes